• Development of three surface abrasion resistance >3H > 4H (without lacquer)
• The process developed Anti-Glare / Anti-Reflection surface finishes

• Development of Anti-Fingerprint surface coating
• Development of low sheer compression moulding for low optical distortion, including insert moulding.  

Integration of Surface Functionality

• Incorporation of capacitance circuitry within 3 dimensional decorative film structure (Cu)
• Integration of directional illumination (OLED / MLED)
• Fine track printing (< 10 micron track width) for optical surfaces (Silver)
• Tactile sensory feed-back – under development
• Incorporation of component mounting onto flexible Cu printed circuits

Industrial Process Development

• Automated / semi-automated module assembly (incl EOL test)
• Large surface thermo / thermo-mechanical forming and molding (> 1,000T)
• Surface bonding [LOCA] (class 1,000) of capacitive sensors onto polymer lens (2.5D)
• In-moulding of glass (2D) surfaces