Integration of Surface Functionality
- Incorporation of capacitance circuitry within 3 dimensional decorative film structure (Cu)
- Integration of directional illumination (OLED / MLED)
- Fine track printing (< 10 micron track width) for optical surfaces (Silver)
- Tactile sensory feed-back – under development
- Incorporation of component mounting onto flexible Cu printed circuits
Industrial Process Development
- Automated / semi-automated module assembly (incl EOL test)
- Large surface thermo / thermo-mechanical forming and molding (> 1,000T)
- Surface bonding [LOCA] (class 1,000) of capacitive sensors onto polymer lens (2.5D)
- In-moulding of glass (2D) surfaces